metal pipe copper pipeline profile processing of the particularity of its requirements for copper plating process is different from that of conventional steel parts copper plating so how to choose suitable for wire profile processing with copper plating process is a very important topic usually choose electroplating process based on the first electroplating material itself requirements for plating That is, the product is processed first, and then electroplating, such as thickness, brightness, hardness and dispersion ability, etc., and some of the current efficiency and accumulation speed requirements are to see the required pre-coating of copper plating center coating and outer coating, and the characteristics of copper pipeline profile processing electroplating is that the processing process of wire and electroplating process is sometimes synchronized That is, some is first after the plating, some is first after plating even the electroplating of the product wire, but also in the traction of the line machine selected technology in addition to the different use according to wire and coating requirements, but also consider electroplating workers to wire walking speed traction of the length of the processing line and other factors adaptability About CO2 gas welding wire for maintenance, because of the copper on the wire attached quantity has the strict limit, such as copper content per unit volume should be within 0.52 (mass fraction) of the solder, belong to a very thin coating, chemical immersion method i.e. replacement copper plating can meet the requirements, but because the present domestic use traditional way to replace copper plating, the binding force Plating color cannot meet the product requirements And in practice to choose the first dip again drawing process, the copper layer extension and thinning in the drawing, to reach the product requirement This approach often present coating fall off Show the phenomenon Therefore, choose has good bonding strength and ductility of copper plating process for about gas shielded welding wire is very important In the new can make silk products once the success of chemical copper plating of copper tube technology present before, still can only choose to the first axis diameter, pull products again after copper plating technology suitable this processing technology should be cyanide copper plating or matte acidic copper plating Because the toxicity of cyanide is too big, in metallurgy copper pipe material processing industry has very few people use At present, the more popular method is still chemical copper leaching and then thickening copper plating and then drawing used for thickening copper plating for acid copper plating or pyrophosphate copper plating in flat wire processing industry also choose chemical copper plating traditional replacement copper plating is copper sulfate and sulfuric acid process Only in a very short time can have a very thin coating replacement, in the above copper plating thickening, binding force is not strong if in this chemical replacement plating immersion time is too long, not only will not add coating thickness, but also make the coating becomes loose and porous, iron matrix will also produce corrosion, wire strength greatly decreased The improvement method is to add additives with appearance blocking effect in the replacement copper plating solution, so that the replacement process orderly aspiring additives and certain light effect on the need to have a certain thickness or even thick coating wire products, the selection of replacement coating bottom to be very careful At least, there is no firm to adapt to the render of thick copper plating electroplating process before, about the thickness of copper plating, solid technology still should choose electrochemical method of precoated precoated with cyanide copper plating nickel plating and high P than pyrophosphate copper plating weigh the advantages and disadvantages, in wire drawing industry, electroplating nickel plating as precoated render is better While the thickening copper plating can choose acidic sulfate copper plating This is because after process adjustment, acid copper plating can adapt to the requirements of high-speed electroplating current density can reach 30~50A/dm2, so that the accumulation speed greatly improved by contrast, cyanide copper plating because of environmental pollution problems should not be selected, and pyrophosphate copper plating because of complex composition, not only high cost, and not suitable for work in large current The test shows that in the high-speed electroplating of acid copper plating, when the current density increases, the deposition speed of the coating also increases at the same time.